Samsung displayed its HBM4 memory technology to attendees at the Semiconductor Exhibition 2025, achieving a 90 percent logic die yield that positions the South Korean manufacturer for mass production. The company plans to offer faster pin speeds around 11 gigabits per second compared to competitors SK hynix and Micron, while maintaining competitive pricing and higher output capacity. Samsung aims to regain its market position in the high-bandwidth memory segment, having faced years of weaker performance, by learning from past production missteps.
The firm has not secured NVIDIA approval for HBM4 supply, but remains confident about future partnerships given its technological progress. SK hynix presented its own modules developed with TSMC at the same event. The memory market faces intensifying competition as demand exceeds earlier projections and manufacturers accelerate development timelines for artificial intelligence applications.
