Samsung is enhancing its semiconductor manufacturing with two High-NA EUV lithography systems from ASML, set to be operational by mid-2026. This follows the earlier deployment of the TWINSCAN EXE:5000 system at its Hwaseong facility for testing. The new TWINSCAN EXE:5200B tools are designed for mass production, helping Samsung advance to next-generation nodes.
The first EXE:5200B unit will arrive in late 2025, with a second expected in early 2026. This system, ASML’s first commercially ready High-NA EUV platform, supports volume production and is already being used by Intel, TSMC, and SK Hynix. Samsung plans to use the new technology to manufacture advanced chips like the Exynos 2600 SoC and Tesla’s AI accelerator.
Each EXE:5200B system costs around $386 million, with the total investment reaching about $773 million. The High-NA EUV technology offers better resolution, higher transistor density, and improved yields at sub-2nm nodes, making it a key tool for Samsung’s 2nm process roadmap.
